The ABS-G4, a new generation of industrial Automatic Breaking Systems specifically designed for the Flat Panel Display Industry, is matched to Fonon Technology precision Laser Glass Scriber Fantom™ G4.

This system will process up to Generation 4 fully scribed glass panels. It is designed to transport, precision align, and separate the glass panels along the scribe lines, propagating the ZWLCT™ (Zero Width Laser Cutting Technology™) laser scribe all the way through the glass.

This breaking system complements the Fantom™ G4 Laser Scribing System with compatible software control language, files, and operational formats.

The F470GF is the first in the world laser scribing system with simultaneous scribe and break capabilities.

A state of the art new generation of glass scribing systems, it can operate as a standalone or a component for an inline system.

The system is based on Fantom™ technology and built from modern components allowing modular replacement and enhanced reliability.

The system does not have any external laser optics and does not require any field alignment.

Direct drive 4 axis motion system and vision image recognition insures smooth integration into any manufacturing line.

Capabilities

• Applications include but not limited to singulation of Flat Panel Displays, new generation of miniature TFT LCD, OLED from single sided and double layer panels.
• Maximum substrate size is 500 x 500 mm.

System has:

• Remote monitoring
• Clean room level 10.000 and 1.000
• Advanced vacuum holding table
• Pre-wired for inline integration

Applications:

• Color Filters
• FPD (Flat Panel Displays) Manufacturing
• Touch Screens
• Precision Glass Fabrication
• Large Panel Glass Scribing
• Microscope Slides & Covers

Capabilities:

• Capable of scribing glass panels for up to 1000mm x 1000mm
• Capable of scribing on any type of display glass (except quartz) without realignments
• Extremely stable singulation line, ensures highest possible edge quality
• No chipping and no glass particles generated
• Cross Cuts - no cut initiations on the crossing, no chipping

General Advantages:

• High scribing speed - up to 1000mm/s
• Extremely high accuracy - up to 10 microns achievable
• Excellent integrity of cut surfaces
• Cut edge is free of stress, no micro-fracturing present
• Edges have an optical quality
• It produces non-dimensional cut line with no residue
• Built-in modular (easy to replace) power supply, amplifiers, PC control, and high-voltage electronics
• ZWLCT® - Zero Width Laser Cutting Technology® produces no particulates or material loss

BLACKSTAR™ is a Wafer Dicing System utilizing a basic Zero Width Laser Dicing Technology® (ZWLDT®) invented and patented by Fonon Technology and modified to accommodate the requirements of a silicon wafer singulation process without affecting the existent dicing method, processes, or procedures.

Wafers have the highest value at the dicing stage and the primary focus of a BlackStar™ is to increase the number of dies, yield per wafer, and to maximize throughput while minimizing the HAZ specifically for “power hungry” RF micro devices and low-K wafer substrates.
System is applicable for dicing of assorted semiconductor materials such as silicon (Si), gallium arsenide (GaAs), germanium (Ge), indium phosphide (InP), silicon carbide (SiC), gallium nitride (GaN), gallium phosphide (GaP), other compound materials, as well as low-k and multi-layer composite materials.

BlackStar™ is an alternative to mechanical saws too damaging and costly for cutting of thin delicate silicon, low-K, and complex material wafers.

The SBM777DC redesigned general purpose ceramic scribing system is designed and fabricated from modern components allowing modular replacement and enhanced reliability.

Direct drive 4 axis motion system, vision image recognition and advanced vacuum holding table makes it ideal tool for high production volumes.

System can be equipped with CO2 laser and innovative fiber laser for better precision and higher edge quality. (Selection depends on ceramic type)

Economical advantages for users:

• Reduced space for Laser Scribing
• “Plug-n-play” characteristics give the system ease of installation and quick start-up times.
• Remote Internet monitoring and diagnostics.
• Programmable Loading and Unloading positions for in line integration.
• Large substrate size up to 600 x 600 mm.
• It can be equipped with dual heads for increased throughput. Video system will allow automatic machine set up and fiduciary marks recognition for automatic parts alignment.