engineering fundamentals Saturn Electronics Corp.

Saturn Electronics Corp.
Company
Profile
Saturn Electronics Corporation, Bare Board Manufacturer, is a leading manufacturer of high-reliability, and technologically advanced printed circuit boards. Dedicated to quality since our inception, Saturn delivers steadfast manufacturing that ranges from quick-turning elaborate prototypes to scheduled principal volume-production.

Saturn’s adherence to quality resulted in being the first PCB Manufacturer in North America to achieve TS16949 certification.

Saturn’s obligation to fiscal prudence makes it a debt-free, financially strong Corporation allocating profits for expansion, improved capabilities, and reduced cost.

Providing solutions while lowering costs is the reason Saturn can meet all your Printed Circuit Board needs.

Products

Heavy Copper PCB

Via-in-Pad

Thermal Management

Cavity Boards

Internal Cavity Printed Circuit Boards

Contact James W. Kelch
Address 28450 Northline Rd.
Romulus, Mi 48174
Country United States
Telephone 734.941.8100
Fax 734.941.3707
Email jim@saturnelectronics.com
Website www.saturnelectronics.com
 Showcase Products
 
Product image coming soon...
Heavy Copper PCB
Heavy Copper Multilayer
At one point in recent history, Saturn was one of North America's largest users of heavy copper laminate, which we used in the production of power distribution boards for the automotive industry. We retained our skill set in precision etching heavy copper and applied it to other industries, namely the power supply industry. Furthermore, we applied our registration system to address concerns such as layer to layer winding registration, dry resin, and etch factors commonly seen by users of heavy copper multilayer boards. We commonly produce boards with 2, 3, 4, & 6 ounce copper with up to 20 layers.

Industries served include:

Automotive

Medical

Aerospace

Military
-Electrical and Electronic Components > PC Board
 
Product image coming soon...
Via-in-Pad
Via-in-pad technology involves merging a through via with an SMT pad (typically BGA pad).  Putting the via in the pad creates space on the external layers for more routing and avoids potential shorts during assembly. The routing channel width on the internal layers will not change.  The process flow for this technology adds a great deal of time and labor to the standard MLB process flow, but achieves results and component footprints that are not possible in the standard process.
-Electrical and Electronic Components > PC Board
 
Product image coming soon...
Thermal Management
Thermal management can be attained through a variety of means for PCB's.  These can include one or a combination of the following characteristics:

Heavy Copper
Secondary Heatsink Application
Metal Substrate

Applications can include high power, led / lighting, and power supplies.

Industries served include:

Aerospace

Military

-Electrical and Electronic Components > PC Board
 
Product image coming soon...
Cavity Boards
Cavity boards are multilayer designs that expose inner layers to air by requiring pockets of material to be cut out. This requires laminating precut materials, controlled-depth fabrication, tight processing controls, and manufacturing versatility. Also, our standardized Multi-Line tooling systems have been critical in the processing of cavity boards.

Industries served include:

Military

RF/Microwave

Automotive - Close Proximity Radar

-Electrical and Electronic Components > PC Board
 
Product image coming soon...
Internal Cavity Printed Circuit Boards
Internal-Cavity boards are multilayer designs that require air gaps in internal layers. Again, this requires laminating precut materials, tight processing controls, manufacturing versatility, and standardized Multi-Line tooling systems to manufacture cost-effectively in volume quantities.

Industries served include:

Military

RF/Microwave

Automotive - Close Proximity Radar
-Electrical and Electronic Components > PC Board
 
 

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