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15% Graphite Filled PI is a subcategory of Polyimide. The additative is added by weight during the manufacturing process. Its flexural modulus ranges from 460 to 500 MPa. Its tensile strength ranges from 8000 to 8400 MPa at break. Its flexural strength ranges from 11000 to 14100 MPa. Its molding pressure ranges from 10 to 30 MPa.
Polyimide, also known as PI, is a thermoplastic or thermoset polycondensate. Common trade names are Vespel and Kapton. thermoplastic It has high impact and dielectric strength, high heat resistance (260 ºC continuous, up to 480 ºC intermittent), and a low coefficient of thermal expansion. PI is commonly used in bearing materials, thrust washers, and semiconductor wafer clamps.
Other common Polyimide (PI) include Unfilled PI, 30% Glass Fiber Reinforced PI, 30% Carbon Fiber Reinforced PI, 30% Carbon Fiber Reinforced PI, 40% Graphite Filled PI, and Unfilled PI.
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