engineering fundamentals
Polyimide: Thermoplastic: Unfilled
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Unfilled PI is a subcategory of Polyimide. The additative is added during the manufacturing process. Its elastic modulus ranges from 300 to 400 MPa. Its flexural modulus ranges from 360 to 500 MPa. Its tensile strength ranges from 10500 to 17100 MPa at break. Its flexural strength ranges from 10000 to 28800 MPa. Its compressive strength ranges from 17500 to 40000 MPa. Its Izod Impact strength ranges from 1.5 to 1.7 J/cm. Its elongation at break ranges from 7.5 to 90 %. Its hardness ranges from 52 to 99 Rockwell E. Its specific gravity ranges from 1.33 to 1.43. Its coefficient of thermal expansion ranges from 45 to 56 x 10-6/°C. Its melting temperature ranges from 250 to 365 °C. Its molding pressure ranges from 3 to 20 MPa.

Polyimide, also known as PI, is a thermoplastic or thermoset polycondensate. Common trade names are Vespel and Kapton. thermoplastic It has high impact and dielectric strength, high heat resistance (260 ºC continuous, up to 480 ºC intermittent), and a low coefficient of thermal expansion. PI is commonly used in bearing materials, thrust washers, and semiconductor wafer clamps.
Additional Information
Other common Polyimide (PI) include 30% Glass Fiber Reinforced PI, 30% Carbon Fiber Reinforced PI, 30% Carbon Fiber Reinforced PI, 15% Graphite Filled PI, 40% Graphite Filled PI, and Unfilled PI.
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