eFunda Polymers: Properties of Polyamide {nylon (PA 612), molding compound}
engineering fundamentals Polymer Material Properties
Directory | Career | News | Standards | Industrial | SpecSearch®
Generic (ABS, ...) Trade Name
Materials Home
General Information
Polymer Home
Glossary
Material Science
Overview
Characteristics
Comparisons
Selection Criteria
Applications
Flow Characteristics
Datasheet Primer
Major Categories
Polymer Index
History Timeline
List by Process
List by ThermoP/S
Specific Polymer
Category / Grades
Datasheet
Supplier Info
Resources
Bibliography


Login

Home Membership Store Forum Search Member Calculators

Materials

Design

Processes

Units

Formulas

Math
 
Polyamide
 
List of Suppliers
State: nylon (PA 612)
Application: molding compound
Material Properties
 Mechanical Properties Conditions
State 1 State 2 ASTM
Elastic Modulus (MPa)   1505 - 2001  tensile  dry (0.2% water content) D638
  849 - 1242  tensile  50% relative humidity D638
Flexural Modulus (MPa)   1656 - 2305   23 ºC  dry (0.2% water content) D790
  511 - 690   23 ºC  50% relative humidity D790
Tensile Strength (MPa)   45 - 61 at break  dry (0.2% water content) D638
  41 - 58 at yield  dry (0.2% water content) D638
  22 at yield  50% relative humidity D638
Flexural Strength (MPa)
at yield or break
  76  dry (0.2% water content)   D790
Flexural Strength (MPa)
at yield or break
  30  50% relative humidity   D790
Elongation at break (%)   150    dry (0.2% water content) D638
  300    50% relative humidity D638
Hardness   78  Rockwell M  dry (0.2% water content) D638
  34  Rockwell M  50% relative humidity D638
 115  Rockwell R   D638
  72 - 80  Shore D  dry (0.2% water content) D638
  63  Shore D  50% relative humidity D638
Izod Impact (J/cm of notch)
1/8" thick specimen unless noted
  0.5 - 1.0    dry (0.2% water content) D256A
Izod Impact (J/cm of notch)
1/8" thick specimen unless noted
  0.7 - 0     D256A

 Thermal Properties Conditions
Pressure State ASTM
Deflection Temperature (ºC)  155 - 166   0.46 MPa  dry (0.2% water content) D648
  58 - 83   1.82 MPa  dry (0.2% water content) D648
Thermal Conductivity (W/m-ºC)  0.217     C177

 Physical & Electrical Properties Conditions
State ASTM
Specific Gravity  1.06 - 1.1   D792
Water Absorption (% weight increase)  2.5 - 3  saturated D570
 0.37 - 1  after 24 hrs D570
Dielectric Strength (V/mil);
1/8" thick specimen unless noted
  400  dry (0.2% water content) D149

 Processing Properties Conditions
Type ASTM
Melting Temperature (ºC)  195 - 219  Tm, crystalline  
Processing Temperature (ºC)  233 - 288  injection molding  
 240 - 243  extrusion  
Molding Pressure (MPa)   7 - 104    
Linear Mold Shrinkage (cm/cm)  0.011   D955

Top of Page

Suppliers
A. Schulman Akron, OH  800-662-7203
ALM Corp. Wayne, NJ   
Ashley Polymers Brooklyn, NY   
Creanova, Inc. Somerset, NJ   
DuPont Co., Polymers Wilmington, DE  800-438-7225
EMS-American Grilon, Inc. Sumter, SC   
M.A. Hanna Engineered Materials Norcross, GA   

Top of Page

Home  Membership  About Us  Privacy  Disclaimer  Contact  Advertise

Copyright © 2009 eFunda, Inc.