eFunda Polymers: Properties of Silicone {mineral and/or glass filled, molding and encapsulating compounds}
engineering fundamentals Polymer Material Properties
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Silicone
 
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Additives: mineral and/or glass filled
Application: molding and encapsulating compounds
Material Properties
 Mechanical Properties Conditions
State 1 State 2 ASTM
Tensile Strength (MPa)   4 - 11 at break   D638
Elongation at break (%)   80 - 800     D638
Hardness   10 - 80  Shore A   D638

 Thermal Properties Conditions
Pressure State ASTM
Coef of Thermal Expansion (10-6/ºC)   20 - 50     D696
Deflection Temperature (ºC)  260   1.82 MPa  lower limit D648
Thermal Conductivity (W/m-ºC)  0.300     C177

 Physical & Electrical Properties Conditions
State ASTM
Specific Gravity  1.8 - 2.05   D792
Water Absorption (% weight increase)  0.15 - 0.4  saturated D570
 0.15  after 24 hrs D570
Dielectric Strength (V/mil);
1/8" thick specimen unless noted
  200 - 550   D149

 Processing Properties Conditions
Type ASTM
Melting Temperature (ºC)  thermoset  Tm, crystalline  
Processing Temperature (ºC)  138 - 183  compression molding  
 166 - 188  transfer molding  
 166 - 188  injection molding  
Molding Pressure (MPa)   3 - 42    
Compression Ratio  2 - 8    
Linear Mold Shrinkage (cm/cm)  0 - 0.005   D955

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Suppliers
Cytec Fiberite, Inc. Tempe, AZ   
Dow Corning Corp. Midland, MI  800-346-9882
GE Silicones Waterford, NY  800-255-8886

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