eFunda Polymers: Properties of Epoxy {bisphenol, mineral filled, molding compounds}
engineering fundamentals Polymer Material Properties
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Epoxy
 
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State: bisphenol
Additives: mineral filled
Application: molding compounds
Material Properties
 Mechanical Properties Conditions
State 1 State 2 ASTM
Elastic Modulus (MPa)   4485  compressive   D638
  2415  tensile   D638
Flexural Modulus (MPa)   9660 - 13800   23 ºC   D790
Tensile Strength (MPa)   28 - 75 at break   D638
Compressive Strength (MPa)
at yield or break
 124 - 276     D695
Flexural Strength (MPa)
at yield or break
  41 - 124     D790
Hardness  100 - 112  Rockwell M   D638
Izod Impact (J/cm of notch)
1/8" thick specimen unless noted
  0.2 - 0.3     D256A

 Thermal Properties Conditions
Pressure State ASTM
Coef of Thermal Expansion (10-6/ºC)   20 - 60     D696
Deflection Temperature (ºC)  107 - 260   1.82 MPa   D648
Thermal Conductivity (W/m-ºC)  0.167 - 1.463     C177

 Physical & Electrical Properties Conditions
State ASTM
Specific Gravity  1.6 - 2.1   D792
Water Absorption (% weight increase)  0.03 - 0.2  after 24 hrs D570
Dielectric Strength (V/mil);
1/8" thick specimen unless noted
  250 - 420   D149

 Processing Properties Conditions
Type ASTM
Melting Temperature (ºC)  thermoset  Tm, crystalline  
Processing Temperature (ºC)  121 - 193  compression molding  
 121 - 193  transfer molding  
Molding Pressure (MPa)   1 - 21    
Compression Ratio  2 - 3    
Linear Mold Shrinkage (cm/cm)  0.002 - 0.01   D955

Suppliers
Amoco Electronic Materials Alpharetta, GA   
Cytec Fiberite, Inc. Tempe, AZ   
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