eFunda Polymers: Properties of Epoxy {bisphenol, low density, glass sphere filled, molding compounds}
engineering fundamentals Polymer Material Properties
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Epoxy
 
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State: bisphenol, low density
Additives: glass sphere filled
Application: molding compounds
Material Properties
 Mechanical Properties Conditions
State 1 State 2 ASTM
Flexural Modulus (MPa)   3450 - 5175   23 ºC   D790
Tensile Strength (MPa)   17 - 28 at break   D638
Compressive Strength (MPa)
at yield or break
  69 - 104     D695
Flexural Strength (MPa)
at yield or break
  35 - 48     D790
Izod Impact (J/cm of notch)
1/8" thick specimen unless noted
  0.1 - 0.1     D256A

 Thermal Properties Conditions
Pressure State ASTM
Deflection Temperature (ºC)   93 - 121   1.82 MPa   D648
Thermal Conductivity (W/m-ºC)  0.167 - 0.251     C177

 Physical & Electrical Properties Conditions
State ASTM
Specific Gravity  0.75 - 1   D792
Water Absorption (% weight increase)  0.2 - 1  after 24 hrs D570
Dielectric Strength (V/mil);
1/8" thick specimen unless noted
  380 - 420   D149

 Processing Properties Conditions
Type ASTM
Melting Temperature (ºC)  thermoset  Tm, crystalline  
Processing Temperature (ºC)  121 - 149  compression molding  
 121 - 149  injection molding  
Molding Pressure (MPa)   1 - 14    
Compression Ratio  3 - 7    
Linear Mold Shrinkage (cm/cm)  0.006 - 0.01   D955

Suppliers
Cytec Fiberite, Inc. Tempe, AZ   
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