eFunda Polymers: Properties of Epoxy {mineral and glass filled, novolak molding compounds, encapsulation}
engineering fundamentals Polymer Material Properties
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Epoxy		  
List of Suppliers
Additives: mineral and glass filled
Application: novolak molding compounds, encapsulation
Material Properties
 Mechanical Properties Conditions
State 1 State 2 ASTM
Elastic Modulus (MPa)  14490  tensile   D638
Flexural Modulus (MPa)   9660 - 16560   23 ºC   D790
Tensile Strength (MPa)   35 - 87 at break   D638
Compressive Strength (MPa)
at yield or break		  166 - 332     D695
Flexural Strength (MPa)
at yield or break		   69 - 151     D790
Hardness  115  Rockwell M   D638
  70 - 75  Barcol   D638
Izod Impact (J/cm of notch)
1/8" thick specimen unless noted		   0.2 - 0.3     D256A

 Thermal Properties Conditions
Pressure State ASTM
Coef of Thermal Expansion (10-6/ºC)   18 - 43     D696
Deflection Temperature (ºC)  149 - 260   1.82 MPa   D648
Thermal Conductivity (W/m-ºC)  0.418 - 1.296     C177

 Physical & Electrical Properties Conditions
State ASTM
Specific Gravity  1.6 - 2.05   D792
Water Absorption (% weight increase)  0.15 - 0.3  saturated D570
 0.04 - 0.29  after 24 hrs D570
Dielectric Strength (V/mil);
1/8" thick specimen unless noted		   325 - 450   D149

 Processing Properties Conditions
Type ASTM
Melting Temperature (ºC)  145 - 155  Tg, amorphous  
Melting Temperature (ºC)  thermoset  Tm, crystalline  
Processing Temperature (ºC)  138 - 183  compression molding  
 122 - 194  transfer molding  
 144 - 177  injection molding  
Molding Pressure (MPa)   2 - 21    
Linear Mold Shrinkage (cm/cm)  0.004 - 0.008   D955

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Suppliers
Amoco Electronic Materials Alpharetta, GA   
Cosmic Plastics, Inc. Valencia, CA  800-423-5613
Cytec Fiberite, Inc. Tempe, AZ   
Rogers Corp. Rogers, CT  800-227-6437

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