eFunda Polymers: Properties of Epoxy {mineral and glass filled, novolak molding compounds, high temperature}
engineering fundamentals Polymer Material Properties
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Epoxy
 
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Additives: mineral and glass filled
Application: novolak molding compounds, high temperature
Material Properties
 Mechanical Properties Conditions
State 1 State 2 ASTM
Elastic Modulus (MPa)  15870 - 16560  tensile   D638
  4554  compressive   D638
Flexural Modulus (MPa)  15870 - 16560   23 ºC   D790
Tensile Strength (MPa)   42 - 107 at break   D638
Compressive Strength (MPa)
at yield or break
 207 - 332     D695
Flexural Strength (MPa)
at yield or break
  69 - 151     D790
Hardness   78  Barcol   D638
Izod Impact (J/cm of notch)
1/8" thick specimen unless noted
  0.2 - 0.2     D256A

 Thermal Properties Conditions
Pressure State ASTM
Coef of Thermal Expansion (10-6/ºC)   35     D696
Deflection Temperature (ºC)  260   1.82 MPa   D648
Thermal Conductivity (W/m-ºC)  0.711 - 1.003     C177

 Physical & Electrical Properties Conditions
State ASTM
Specific Gravity  1.85 - 1.94   D792
Water Absorption (% weight increase)  0.15 - 0.17  after 24 hrs D570
Dielectric Strength (V/mil);
1/8" thick specimen unless noted
  440 - 450   D149

 Processing Properties Conditions
Type ASTM
Melting Temperature (ºC)  155 - 195  Tg, amorphous  
Melting Temperature (ºC)  thermoset  Tm, crystalline  
Processing Temperature (ºC)  172 - 205  transfer molding  
Molding Pressure (MPa)   4 - 18    
Compression Ratio  1.5 - 2.5    
Linear Mold Shrinkage (cm/cm)  0.004 - 0.007   D955

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Suppliers
Amoco Electronic Materials Alpharetta, GA   
Cosmic Plastics, Inc. Valencia, CA  800-423-5613
Cytec Fiberite, Inc. Tempe, AZ   
Rogers Corp. Rogers, CT  800-227-6437

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