eFunda Polymers: Properties of Phenolic {phenol-formaldehyde, mineral or mineral / glass filled, molding compounds, heat resistant}
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Phenolic		  
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State: phenol-formaldehyde
Additives: mineral or mineral / glass filled
Application: molding compounds, heat resistant
Material Properties
 Mechanical Properties Conditions
State 1 State 2 ASTM
Elastic Modulus (MPa)  16560  tensile   D638
Flexural Modulus (MPa)   6900 - 13800   23 ºC   D790
Tensile Strength (MPa)   42 - 69 at break   D638
Compressive Strength (MPa)
at yield or break		  156 - 249     D695
Flexural Strength (MPa)
at yield or break		   76 - 97     D790
Elongation at break (%)   1 - 1     D638
Hardness   88  Rockwell E   D638
  70  Barcol   D638
Izod Impact (J/cm of notch)
1/8" thick specimen unless noted		   0.1 - 0.3     D256A

 Thermal Properties Conditions
Pressure State ASTM
Coef of Thermal Expansion (10-6/ºC)   19 - 38     D696
Deflection Temperature (ºC)  135 - 247   1.82 MPa   D648
Thermal Conductivity (W/m-ºC)  0.418 - 1.003     C177

 Physical & Electrical Properties Conditions
State ASTM
Specific Gravity  1.42 - 1.84   D792
Water Absorption (% weight increase)  0.06 - 0.5  saturated D570
 0.02 - 0.3  after 24 hrs D570
Dielectric Strength (V/mil);
1/8" thick specimen unless noted		   200 - 350   D149

 Processing Properties Conditions
Type ASTM
Melting Temperature (ºC)  thermoset  Tm, crystalline  
Processing Temperature (ºC)  133 - 177  compression molding  
 149 - 177  transfer molding  
 166 - 194  injection molding  
Molding Pressure (MPa)   14 - 138    
Compression Ratio  2.1 - 2.7    
Linear Mold Shrinkage (cm/cm)  0.002 - 0.006   D955

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Suppliers
Amoco Electronic Materials Alpharetta, GA   
Cytec Fiberite, Inc. Tempe, AZ   
Occidental Chemical Corp. Dallas, TX  800-578-8880
Plaslok Corp. Buffalo, NY  800-828-7913
Plastics Engineering, Inc. Auburn Hills, MI   
Resinoid Engineering Corp. Hebron, OH   
Rogers Corp. Rogers, CT  800-227-6437

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