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Glossary » Materials » Polymers » Polycarbonate » Copolymer » Polyester Copolymer » High Heat
Polyester Copolymer High Heat PC is a subcategory of Polycarbonate. The additative is added during the manufacturing process. Its elastic modulus ranges from 320 to 340 MPa. Its flexural modulus ranges from 294 to 340 MPa. Its tensile strength ranges from 9500 to 11300 MPa at break. Its flexural strength ranges from 10000 to 13800 MPa. Its Izod Impact strength ranges from 1.5 to 10 J/cm. Its elongation at break ranges from 50 to 122 %. Its hardness ranges from 74 to 92 Rockwell M. Its specific gravity ranges from 1.15 to 1.2. Its coefficient of thermal expansion ranges from 70 to 92 x 10-6/°C. Its melting temperature ranges from 160 to 195 °C. Its molding pressure ranges from 8 to 20 MPa.
Polycarbonate, also known as PC, is a thermoplastic polycondensate. Common trade names are Lexan and Makrolon. copolymer It has excellent strength, toughness, dimensional stability, dielectric strength, flame retardancy, and impact resistance (highest among transparent rigid materials). It is, however, susceptible to stress cracking with aromatic solvents, and is difficult to machine. PC can be used to make optical lenses, windows, medical items, CD's, and power tool housings. It can also be used in truck cabs.
Additional Information
Other common Polycarbonate (PC) include Unfilled Molding and Extrusion Resins, High Viscosity PC, Unfilled Molding and Extrusion Resins, Low Viscosity PC, 10% Glass Fiber Reinforced PC, 30% Glass Fiber Reinforced PC, 20 - 30% Long Glass Fiber Reinforced PC, 40% Long Glass Fiber Reinforced PC, 50% Long Glass Fiber Reinforced PC, 35% Random Glass Mat PC, 20 - 30% Long Glass Fiber Reinforced Flame-Retardant Grade PC, Polycarbonate Copolymer High Heat PC, Polycarbonate / Polyester Blends, Impact Modified PC, 6% Stainless Steel Fiber Conductive PC, 10% Stainless Steel Fiber EMI Shielding (conductive) PC, 20% PAN Carbon Fiber EMI Shielding (conductive) PC, 30% PAN Carbon Fiber EMI Shielding (conductive) PC, 40% PAN Carbon Fiber EMI Shielding (conductive) PC, 10-15% PTFE Lubricated PC, 30% PTFE Lubricated PC, 10-15% PTFE, 20% Fiber Reinforced Lubricated PC, and 2% Silicone, 30% Glass Fiber Reinforced Lubricated PC.
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Direct Metal Laser Sintering (DMLS) 3D printing for parts with reduced cost and little waste.

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