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Glossary » Materials » Polymers » Polyimide » 30% Glass Fiber Reinforced
30% Glass Fiber Reinforced PI is a subcategory of Polyimide. The additative is added by weight during the manufacturing process. Its coefficient of thermal expansion ranges from 17 to 53 x 10-6/°C. Its molding pressure ranges from 10 to 30 MPa.
Polyimide, also known as PI, is a thermoplastic or thermoset polycondensate. Common trade names are Vespel and Kapton. thermoplastic It has high impact and dielectric strength, high heat resistance (260 ºC continuous, up to 480 ºC intermittent), and a low coefficient of thermal expansion. PI is commonly used in bearing materials, thrust washers, and semiconductor wafer clamps.
Additional Information
Other common Polyimide (PI) include Unfilled PI, 30% Carbon Fiber Reinforced PI, 30% Carbon Fiber Reinforced PI, 15% Graphite Filled PI, 40% Graphite Filled PI, and Unfilled PI.
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Essentials of Manufacturing

Information, coverage of important developments and expert commentary in manufacturing.

Selecting the Right 3D Printer

Discover how to choose the right 3D printer for your needs and the key performance attributes to consider.

Metal 3D Printing Design Guide

Direct Metal Laser Sintering (DMLS) 3D printing for parts with reduced cost and little waste.

CNC Machining Design Guide

Optimize your designs, reduce machining time, and lower your costs.

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