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Glossary » Materials » Polymers » Polyimide » 30% Glass Fiber Reinforced
30% Glass Fiber Reinforced PI is a subcategory of Polyimide. The additative is added by weight during the manufacturing process. Its coefficient of thermal expansion ranges from 17 to 53 x 10-6/°C. Its molding pressure ranges from 10 to 30 MPa.
Polyimide, also known as PI, is a thermoplastic or thermoset polycondensate. Common trade names are Vespel and Kapton. thermoplastic It has high impact and dielectric strength, high heat resistance (260 ºC continuous, up to 480 ºC intermittent), and a low coefficient of thermal expansion. PI is commonly used in bearing materials, thrust washers, and semiconductor wafer clamps.
Additional Information
Other common Polyimide (PI) include Unfilled PI, 30% Carbon Fiber Reinforced PI, 30% Carbon Fiber Reinforced PI, 15% Graphite Filled PI, 40% Graphite Filled PI, and Unfilled PI.
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Injection Molding Design Guide

Guide for high quality and cost-effective plastic injection molding.

STEM Career Outlook

Wages, employment opportunities, and growth projections for STEM jobs.

Essentials of Manufacturing

Information, coverage of important developments and expert commentary in manufacturing.

Mechanical Engineers Outlook

Guide for those interested in becoming a mechanical engineer. Includes qualifications, pay, and job duties.

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