Injection Molding Design Guide

Guide for high quality and cost-effective plastic injection molding.

Laser Focus World

Semiconductors, medical equipment, lasers, optics and aviation and aerospace.

Wind Systems

Towers, turbines, gearboxes; processes for shaping and finishing component parts.

Chemical Engineering

The industry gateway for chemical engineering and plant operations.

more free magazines
Glossary » Materials » Polymers » Polyimide » 30% Glass Fiber Reinforced
30% Glass Fiber Reinforced PI is a subcategory of Polyimide. The additative is added by weight during the manufacturing process. Its coefficient of thermal expansion ranges from 17 to 53 x 10-6/°C. Its molding pressure ranges from 10 to 30 MPa.
Polyimide, also known as PI, is a thermoplastic or thermoset polycondensate. Common trade names are Vespel and Kapton. thermoplastic It has high impact and dielectric strength, high heat resistance (260 ºC continuous, up to 480 ºC intermittent), and a low coefficient of thermal expansion. PI is commonly used in bearing materials, thrust washers, and semiconductor wafer clamps.
Additional Information
Other common Polyimide (PI) include Unfilled PI, 30% Carbon Fiber Reinforced PI, 30% Carbon Fiber Reinforced PI, 15% Graphite Filled PI, 40% Graphite Filled PI, and Unfilled PI.
Related Pages
Glossary