Glossary » Materials » Polymers » Polyimide » Unfilled
Unfilled PI is a subcategory of Polyimide. The additative is added during the manufacturing process. Its elastic modulus ranges from 460 to 4650 MPa. Its flexural modulus ranges from 422 to 3000 MPa. Its tensile strength ranges from 4300 to 22900 MPa at break. Its flexural strength ranges from 6500 to 50000 MPa. Its compressive strength ranges from 19300 to 32900 MPa. Its Izod Impact strength ranges from 0.65 to 15 J/cm. Its hardness ranges from 110 to 120 Rockwell M. Its specific gravity ranges from 1.41 to 1.9. Its coefficient of thermal expansion ranges from 15 to 50 x 10-6/°C. Its molding pressure ranges from 7 to 29 MPa.
Polyimide, also known as PI, is a thermoplastic or thermoset polycondensate. Common trade names are Vespel and Kapton. thermoset It has high impact and dielectric strength, high heat resistance (260 ºC continuous, up to 480 ºC intermittent), and a low coefficient of thermal expansion. PI is commonly used in bearing materials, thrust washers, and semiconductor wafer clamps.
Other common Polyimide (PI) include Unfilled PI, 30% Glass Fiber Reinforced PI, 30% Carbon Fiber Reinforced PI, 30% Carbon Fiber Reinforced PI, 15% Graphite Filled PI, and 40% Graphite Filled PI.
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