| Solder | Applications | Characteristics |
| Bismuth |
Low temperature soldering |
Deforms easily. Needs Aggressive fluxes. |
| Cadmium-Silver |
High temperature applications |
Toxic. Good tensile strength |
| Cadmium-Zinc |
Soldering aluminum |
Toxic |
| Indium |
Low temperature soldering, wets glass |
Deforms easily |
| Lead-Silver |
High temperature applications |
Good high temperature properties, good fatigue strength. Medium or low flow properties |
| Tin-Antimony |
High temperature and food industry applications |
Non-toxic. Good high temperature properties. Better electrical conductivity and strength than tin-lead solders. Good wetting. |
| Tin-Antimony-Lead |
General purpose. |
Improved mechanical properties over Tin-Lead solders. Can not be used with zinc due to brittle zinc-antimony inter-metallic compounds |
| Tin-Lead |
General purpose, and the most widely used solders. |
Good process characteristics and the best understood solders. |
| Tin-Silver |
Used for soldering medical or high precision instruments. High temperature applications |
Non-toxic but expensive. Good high temperature properties. |
| Tin-Zinc |
Soldering aluminum |
|
| Zinc-Aluminum |
Soldering aluminum |
|
